[Alex]

Scribing or notching is part of the process in micro system electronics. The essence of this process is to apply hairlines to the surface of the wafer. At the same time, they must be made in two directions and be perpendicular to each other. For this, special tools are used: diamond cutter, laser or wire. As a result of this method, the wafer can be broken first into strips and then into dice.

Also, in microelectronic production, it is planned to use an added area for tests (PCM structure). So the small wafer size will also be consumed. The intended tracks or hairlines, the clearance from the frontier line of the pattern to the wafer’s, as well as the proportion of the test architecture modify from one functional node to another, from one microelectronic production to another. Experts strongly advise obtaining DPW quantities precisely from the production process in microelectronics, since all the accurate data and characteristics necessary to derive ultimate parameters are received in this way.

https://ntlab.lt/die...fer-calculator/