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Engineers Create the First Double-Sided 10-Layer PCB Using 3D Printing

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Engineers Create the First Double-Sided 10-Layer PCB Using 3D Printing


This week, HENSOLDT announced that using a newly-developed dielectric polymer and conductive inks from Nano Dimension, the company has successfully assembled the first 10-layer printed circuit board (PCB) mounting electronic components on both sides of the board.To get more news about Cavity PCB, you can visit pcbmake official website.

Building a multi-layer PCB is an expensive, time-consuming prospect. But, until a manufacturer produces such a board, the product is just a dream that only exists in the memory cells of a simulator. What’s needed is a fast, inexpensive way to come up with a real-world, physical prototype.

A complex board can be generated at a relatively low expense—and in a day, not weeks. In the development stage, few things are more frustrating than kludging a board to reflect a modified design.

With the fast turnaround enabled by additive manufacturing, an up-to-the-minute board is quickly made available. Additionally, for low-run products, using PC printing can serve the whole product cycle, and engineering changes can be easily accommodated at greatly reduced time and expense for fast-evolving devices.
As described by Nano Dimensions, employing 3D printing for PCBs fabrication allows designers to go beyond the standard trace geometries available with standard planar manufacturing processes, ensuring tight impedance control.
This additive manufacturing platform integrates an inkjet deposition printer with its own nano-inks and 3D software. The unit prints electronic circuits such as antennas, capacitors, PCBs, and sensors.Nano Dimensions offers both conducting and polymer inks, including its AgCite Nanoparticle Silver Ink and its Dielectric Nanoparticle Polymer Ink.

AgCite Nanoparticle Silver Ink. Silver particles of 10 to 100 nanometers in size are controlled for shape and particle dispersion, enabling the ink to be optimized for applications such as RFID and OLED components while maintaining excellent conductivity, adhesion, and flexibility.

Dielectric Nanoparticle Polymer Ink. Polymer inks are designed to complement the conductive silver inks and can accommodate width tolerances down to hundreds of microns. To live up to the challenges of multilayer PCB printing, important properties in adhesion, thermal dissipation, and flammability have been designed in.
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